Fan-Yi Ouyang

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Fan-Yi Ouyang

Fan-Yi Ouyang
Professor

Address：ESS Building Room 509
E-mail：fyouyang @ess.nthu.edu.tw
Telephone No.：03-5715131 ext.34321
Laboratory：Electronic Thin Film and Packaging Lab

Discipline

Introduction to Materials Science、Electronic Thin Film、Mechanical Properties of Materials

Specialty

● Microelectronic materials and processing
● Thin film deposition and characterization
● Mass transport (diffusion) and interfacial reaction
● Electromigration, Thermomigration, and Stress migration
● Pb-free solders and Cu interconnect

Our research interest is in Si-based and diffusion driven materials science for modern microelectronic, opto-electronic, bio-sensor, and MEMS devices. The research in our lab currently focuses on the following topics but are not limited to:

● Diffusion mechanism and microstructural evolution under current stressing (Electromigration), a
temperature gradient(Thermomigration), and a stress gradient (Stress-migration) on the Pb-free solders utilized in the flip chip and three-dimensional integrated circuits (3D IC) technologies
● Fabrication of Cu nano-thin film and diffusion mechanism of Cu under current Stressing
● Chemical reaction and kinetics mechanism between under-bump metallization and Sn

Academic Degrees

PhD, University of California, Los Angeles